For printed circuit boards, the production evaluation is carried out from the aspects of insulation coating hardening and drying, interlayer bonding hardening, defoaming, thermal cycle acceleration test, temperature and humidity bias voltage acceleration test, and high temperature and high pressure material moisture resistance test.
LED is produced, inspected and evaluated from defoaming test, high temperature test, low temperature storage test and temperature cycle test.
For magnetic materials, production and evaluation are carried out from drying, low temperature test and high pressure accelerated aging.
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|Electronic parts||Semiconductor||Evaluation||The evaluation for combination between device and PCB||Rapid-Rate Temperature (& Humidity)Cycle Chamber|
|Printed Circuit Board||Production||The hardening and drying for Insulation coating||Industrial Ovens|
|Accelerated Thermal cycling test||Rapid-Rate Temperature (& Humidity) Cycle Chamber|
|Low-temperature testing||Rapid-Rate Temperature (& Humidity) Cycle Chamber|
|LED||Evaluation||High-temperature testing||Industrial Ovens|
|Temperature cycle test||Temperature (& Humidity) Chamber|
|Temperature cycle test||Rapid-Rate Temperature (& Humidity) Cycle Chamber|
|Magnetic Materials||Production||Dry processing||Industrial Ovens|
|Battery||Evaluation||Characteristic Test||Rapid-Rate Temperature (& Humidity) Cycle Chamber|